1～4 item / All 4 items
Thickness measurement of various types of wafers below φ4"
This machine is a device that manually measures the thickness of various materials' wafers with a diameter of 4 inches or less. The thickness measurement is performed using a confocal chromatic aberration sensor, measuring the difference between a block gauge or reference wafer and the target wafer in a one-sided measurement.
Thickness measurement device for silicon wafers with a diameter of φ200mm and φ300mm.
This machine is a device for measuring the thickness of silicon wafers with diameters of φ200mm and φ300mm. The setting and measurement of the wafers are performed by manual operation by the operator.
Thickness measurement of Si, SiC, and other wafers with a diameter of φ100mm to φ150mm.
This machine is a device for manually measuring the thickness of wafers such as Si and SiC with diameters ranging from φ100mm to φ150mm. The thickness measurement is performed using a high-precision contact digital sensor and is conducted on one side.
Thickness measurement of compound semiconductor wafers in sizes φ2”, φ4” or φ6”.
This machine is a device for manually measuring the thickness of compound semiconductor wafers in sizes of φ2”, φ4”, or φ6”. Thickness measurements are performed using an optical sensor, with standalone wafers measured by clamping and wafers attached to a flat plate measured from one side. To conduct each type of measurement, two types of measurement stages are prepared, and the sensors are swapped out for the measurements.
